Polyimide Stiffener,Polyimide Coverlay Film,Bonding Sheet,FCCLs

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Polyimide Film Stiffener

Halogen free Polyimide film stiffener is made of high heat resistant and high adhesive adhesive coating on PI film substrate, and the thickness is from 1mil to 10mil. The excellent properties of heat bonded to ensure its good adhesion on copper foil and PI material, widely used in various FPC reinforcement., Polyimide stiffener have been supplied to world-renowned flexible PCB manufacturers with excellent reputations. are tested according to IPC standards.

Polyimide Coverlay Film ( Yellow/Black )
Halogen free polyimide coverlay film is a kind of high temperature thermosetting epoxy resin coated with polyimide film.
the insulating coating is made of release paper as insulation layer and cured by high temperature. The series
of materials are widely used in FPC manufacturing for line protection and insulation.

Polyimide Bonding Sheet
Pure adhesive film is made of high adhesive polymer adhesive with a thickness of 12-40um.The adhesive film is three layers of composite structure materials, which are protected by a protective film and a release paper.
Pure adhesive film is mainly used in the FPC hot pressing, strengthening, PI, multilayer board bonding,FR4 substrate, soft and hard bonding plate and aluminum based metal plate bonding.

Polyimide Film Based Fccl (Single-side FCCL)(Double-side FCCL)
Epoxy resin PI film based FCCL is composed of three kinds of materials, copper foil, adhesive and PI film,which are compounded by high precision coating technology. With high temperature resistance,high insulation, high flexibility and other characteristics.
Widely used in FPC manufacturing. Type: Single-side FCCL.